Home > Trade Fair Calendar > 2011/06 > 2011 Microelectronics Show - 25th ADVANCED ELECTRONICS PACKAGING EXHIBITION
Japan Trade Fair Calendar
2011 Microelectronics Show - 25th ADVANCED ELECTRONICS PACKAGING EXHIBITION
| Dates | 2011-06-01 to 2011-06-03 |
| Frequency | Annual |
| URL | http://www.jpcashow.com |
| Main Industry Sector | Machinery, Industrial Technology / Electric & Electronics (Products, Machinery) Machinery, Industrial Technology / Testing, Measuring & Analyzing, Precision Mechanics Machinery, Industrial Technology / Advanced Technology/Materials,Composites, R & D |
| Exhibits | Application Products with High-density/High-frequency electronics packaging technologies, High-density Substrates/Interporzers, IC Packages, Electronic Components, Embedded Packaging Board, System-in-a-Package, Display Device/Optical Device, Materials related to Electronics Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste Printing Machines, Equipment for manufacturing, Environmental Consideration technologies, Recycle System, Electronics Packaging (Jisso) related Publication, Information, Services, etc |
| Location | Japan / Tokyo |
| Venue | okyo Big Sight (Tokyo International Exhibition Center) |
| Show Management | Japan Institute of Electronics Packaging TEL +81-3-5310-2010 FAX +81-3-5310-2011 E-mail jiep-info@jiep.or.jp |
