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TOPPAN to Showcase Sustainable Packaging Synergies with Global Group Companies at interpack 2026

Tokyo – April 23, 2026 – TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), will participate in interpack 2026, the w

Teijin Limited’s New Gas Co-generation System Projected to Cut CO2 Emissions by 200,000 Tons Annually

Tokyo, April 21, 2026: Teijin Limited, a Teijin Group company, announced today that it has commenced full-scale operation of a new in-house power generation facility at the North D

Evonik and Fuhua complete construction of specialty-grade H2O2 plant in Leshan, China

Leshan, China. Evonik Fuhua New Materials has completed construction of its hydrogen peroxide (H2O2) facility in Leshan, Sichuan Province, China. The joint venture between Evonik a

Mitsui Chemicals, Idemitsu Kosan, and Sumitomo Chemical Receive Japan Fair Trade Commission Clearance for the Integration of Sumitomo Chemical's PP and LLDPE Businesses into Prime Polymer

Mitsui Chemicals, Inc. (head office: Chuo-ku, Tokyo; President & CEO: Satoshi Ichimura; hereinafter “Mitsui”), Idemitsu Kosan Co.,Ltd. (head office: Chiyoda-ku, Tokyo; Repr

DNP Launches Mass Production of Decorative Film for Automotive Displays Combining Premium Design with High-Visibility Imaging

Tokyo, April 23, 2026 — Dai Nippon Printing Co., Ltd. (DNP) has announced that it will begin mass production in April 2026 of a new decorative film for automotive displays＊1. T

Futamura and Biopap Advance Compostable Food Service Solutions

Futamura UK, a global leader in sustainable cellulose-based solutions, and Biopap®, a pioneer in compostable food packaging, are reinforcing their 25-year relationship to accelera

Flint Group Packaging Solutions returns to FTA FORUM INFOFLEX with a commitment to delivering product solutions for packaging

Flint Group Packaging Solutions returns to FTA FORUM INFOFLEX with a commitment to delivering product solutions for packaging Flint Group Packaging Solutions, a global leader in in

Resonac Launches R&D Center for Next-Gen Semiconductor Package Technology under U.S.-Japanese Consortium “US-JOINT”- Public and private sector representatives from Japan and the U.S. gather for ceremony in Silicon Valley

Resonac Corporation today inaugurated a new R&D center to mark the full-scale launch of “US-JOINT,” a consortium of 12 Japanese and U.S. material and equipment manufacturer

ProPak Asia: KHS showcases its extensive service portfolio

Dortmund/Bangkok, April 22, 2026 – Reliable service, efficient technology and sustainable packaging: the KHS Group will be exhibiting its extensive portfolio of pioneering system

UPM and Royal Vaassen bring recyclable paper innovation to pet treat packaging

(UPM, Helsinki, April 21, 2026 at 10:00 EEST) – UPM Specialty Materials and Royal Vaassen introduce an ultra-high barrier paper packaging solution suitable for pet food treats an

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