TOPPAN to Participate in ‘Rapidus CORE’ Global Ecosystem Framework
Tokyo – October 8, 2026 – TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), will participate as a Design Solution Associate in the Rapidus Collaborative Open Rapid Ecosystem (Rapidus CORE)—a global ecosystem framework for the development and mass production of cutting-edge semiconductors to be established by Rapidus Corporation (Rapidus).
Background & Objectives
In recent years, driven by the rapid growth of AI, high-performance computing, and automated driving technologies, global demand has surged for cutting-edge logic semiconductors that deliver both exceptional processing power and high energy efficiency. Consequently, semiconductor manufacturing processes are transitioning to next-generation nodes, starting with the 2 nm generation. However, as process miniaturization advances, Large-Scale Integration (LSI) design has become extraordinarily complex. Increased risks in manufacturing lead to costly redesigns and heavier verification workloads, driving up development costs and lengthening time-to-market. Addressing these challenges requires advanced design solutions that seamlessly bridge design and manufacturing, alongside open collaborative frameworks.
To drive innovation across the entire semiconductor value chain—from design to front-end and back-end processes—and to accelerate next-generation LSI development by creating partner-driven value beyond traditional supply chain boundaries, Rapidus has launched Rapidus CORE, a global ecosystem framework.
As part of the initial rollout of Rapidus CORE, Rapidus announced Design Solution Associates, a group of design-related companies in which TOPPAN will participate. Design Solution Associates connect customers with Rapidus, providing specialized engineering resources and technical expertise to facilitate the rapid launch of semiconductor development. This collaborative model strengthens support systems from design through manufacturing tailored to diverse customer needs.
Some of TOPPAN’s core strengths are its expertise built over many years in LSI design technology and the optimization of Electronic Design Automation (EDA) environments. In particular, TOPPAN possesses extensive technical know-how in complex design solutions required for advanced process nodes, including low-power design, timing closure addressing Process, Voltage, Temperature (PVT) variations, and high-speed interface implementation.
By joining Rapidus CORE as a Design Solution Associate, TOPPAN will offer end-to-end support for Rapidus customers—from initial specification analysis to circuit design, layout, and physical verification. In doing so, TOPPAN will help significantly reduce the design complexity, cost, and risks associated with cutting-edge process nodes, contributing to establishing a sustainable semiconductor ecosystem.
Future Goals
In addition to contributing to establishing a sustainable ecosystem for next-generation semiconductors, through participation in Rapidus CORE, TOPPAN will contribute to creating new value as well as resolving societal issues by leveraging cutting-edge semiconductor technology.