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At the FESPA Global Print Expo 2026 in Barcelona from 19 to 22 May, Felix Schoeller brought three key areas of expertise together for the first time in a curated concept store. The

Flint Group Packaging Solutions has confirmed its attendance at Flexo & Labels Expo 2026, the Latin American label and flexible packaging industry’s flagship exhibition.

NEW YORK & ZALTBOMMEL, Netherlands, May 21, 2026 – UltiMaker, a global leader in industrial desktop 3D printing, today launched the Factor 4 Plus, an industrial-grade platfor

The new concept consists of five circular segments that are mounted on the turntable from below, each with a cross-section designed in the form of an Acoustic Black Hole (ABH). A d

LINTEC Corporation (the “Company”) hereby announces that the Board of Directors of the Company resolved at the meeting held today to establish LINTEC Tsukuba Innovative Creatio

hubergroup Print Solutions is unveiling another major innovation designed to better meet today’s market requirements. After intensive development work, the international printing

Last December, the Japanese OFF-GRID DESIGN CONSORTIUM is collaborating with MAEDA CORPORATION, a consortium member that has partnered with Tripod Design, the consortium chair, to

TOKYO, Japan, May 19, 2026 - Seiko Epson Corporation (TSE: 6724, "Epson") has been awarded the prestigious honorary title "Red Dot: Design Team of the Year" for

Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows

At ProPak Asia 2026, Sidel will spotlight its advanced technologies, complete line expertise and digital solutions that are helping manufacturers improve efficiency, flexibility an