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The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level

Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows

Sidel drives smart manufacturing innovation at ProPak Asia 2026

At ProPak Asia 2026, Sidel will spotlight its advanced technologies, complete line expertise and digital solutions that are helping manufacturers improve efficiency, flexibility an

Sumitomo Bakelite Announces Trial Launch of Liquid Encapsulant for Advanced Packages

May 18, 2026 - Sumitomo Bakelite Co., Ltd. (Headquarters: Shinagawa-ku, Tokyo; President and Representative Director: Shinichi Kajiya) is pleased to announce the development and tr

Groundbreaking Ceremony Held for New Medical Devices Micro Molding Facility in U.S.

May 18, 2026 - Nissha Medical Technologies (NMT), offering the medical devices CDMO*1 in Nissha Co., Ltd. held a groundbreaking ceremony for a new building to expand its micro mold

Unicharm Enters Pet Care Business in Brazil

May 15, 2026 - Unicharm Corporation (President & CEO: Mr. Takahisa Takahara) hereby announces that it has decided to make Nutrire Indústria de Alimentos Ltda. (Address: RODOVI

TOPPAN Begins Mass Production of Flexible Packaging Using Japan's First EB Offset Printing

TOPPAN Co., Ltd. (Headquarters: Bunkyo-ku, Tokyo; President and CEO: Haruhiko Noguchi; hereinafter “TOPPAN”), a group company of TOPPAN Holdings, has developed Japan’s first

Kurimoto and Hitachi High-Tech launch collaboration to optimize mixing process conditions using mixing data and physical AI

Tokyo, May 11, 2026 – Kurimoto, Ltd. ("Kurimoto") and Hitachi High-Tech Corporation ("Hitachi High-Tech") have launched a collaboration to optimize mixing*1 p

Design Change for Kagome Tomato Ketchup Outer Packaging

Design Change for Kagome Tomato Ketchup Outer Packaging KAGOME CO., LTD. will temporarily change the outer packaging of "Kagome Tomato Ketchup" to a transparent design wi

Gentlebrand launches its SmartWeighting approach, introduced via the MINERA still water bottle

Gentlebrand is introducing its SmartWeighting approach, demonstrated through the MINERA SmartWeighting still water bottle, showing how lightweighting can be achieved without compro

Three Organizations, Including Perovion, a Spin-Out Company of TNO, One of Europe’s Largest Research Institutes, Agree to Build a Collaborative Framework for the Global Deployment of Perovskite Solar Panels

May 15, 2026 - Toyo Seikan Group Holdings, Ltd. (“Toyo Seikan Group Holdings,” Tokyo 5901, President: Takuji Nakamura) has reached an agreement with Perovion Technologies B.V.

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