Fraunhofer Researchers Make Technology Museum QuieterThe new concept consists of five circular segments that are mounted on the turntable from below, each with a cross-section designed in the form of an Acoustic Black Hole (ABH). A dnews
Notice Concerning the Establishment of LINTEC Tsukuba Innovative Creation CenterLINTEC Corporation (the “Company”) hereby announces that the Board of Directors of the Company resolved at the meeting held today to establish LINTEC Tsukuba Innovative Creationews
hubergroup introduces advanced resin technology for offset inkshubergroup Print Solutions is unveiling another major innovation designed to better meet today’s market requirements. After intensive development work, the international printingnews
OPEN MIND Releases hyperMILL® 2026Wessling (Germany), May 20, 2026 – With version 2026 of the CAD/CAM suite hyperMILL®, OPEN MIND Technologies AG is increasing both the speed at which NC programs can be created news
Generating a small amount of electricity from discarded wind turbine bladesLast December, the Japanese OFF-GRID DESIGN CONSORTIUM is collaborating with MAEDA CORPORATION, a consortium member that has partnered with Tripod Design, the consortium chair, to news
Epson Wins the World's Preeminent Design Award,"Red Dot: Design Team of the Year 2026"TOKYO, Japan, May 19, 2026 - Seiko Epson Corporation (TSE: 6724, "Epson") has been awarded the prestigious honorary title "Red Dot: Design Team of the Year" fornews
The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer LevelBreakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allowsnews
Sidel drives smart manufacturing innovation at ProPak Asia 2026At ProPak Asia 2026, Sidel will spotlight its advanced technologies, complete line expertise and digital solutions that are helping manufacturers improve efficiency, flexibility annews
Sumitomo Bakelite Announces Trial Launch of Liquid Encapsulant for Advanced PackagesMay 18, 2026 - Sumitomo Bakelite Co., Ltd. (Headquarters: Shinagawa-ku, Tokyo; President and Representative Director: Shinichi Kajiya) is pleased to announce the development and trnews
Groundbreaking Ceremony Held for New Medical Devices Micro Molding Facility in U.S.May 18, 2026 - Nissha Medical Technologies (NMT), offering the medical devices CDMO*1 in Nissha Co., Ltd. held a groundbreaking ceremony for a new building to expand its micro moldnews