OPEN MIND Releases hyperMILL® 2026
Wessling (Germany), May 20, 2026 – With version 2026 of the CAD/CAM suite hyperMILL®, OPEN MIND Technologies AG is increasing both the speed at which NC programs can be created
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Generating a small amount of electricity from discarded wind turbine blades
Last December, the Japanese OFF-GRID DESIGN CONSORTIUM is collaborating with MAEDA CORPORATION, a consortium member that has partnered with Tripod Design, the consortium chair, to
Epson Wins the World's Preeminent Design Award,"Red Dot: Design Team of the Year 2026"
TOKYO, Japan, May 19, 2026 - Seiko Epson Corporation (TSE: 6724, "Epson") has been awarded the prestigious honorary title "Red Dot: Design Team of the Year" for
The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows
Sidel drives smart manufacturing innovation at ProPak Asia 2026
At ProPak Asia 2026, Sidel will spotlight its advanced technologies, complete line expertise and digital solutions that are helping manufacturers improve efficiency, flexibility an
Sumitomo Bakelite Announces Trial Launch of Liquid Encapsulant for Advanced Packages
May 18, 2026 - Sumitomo Bakelite Co., Ltd. (Headquarters: Shinagawa-ku, Tokyo; President and Representative Director: Shinichi Kajiya) is pleased to announce the development and tr
Groundbreaking Ceremony Held for New Medical Devices Micro Molding Facility in U.S.
May 18, 2026 - Nissha Medical Technologies (NMT), offering the medical devices CDMO*1 in Nissha Co., Ltd. held a groundbreaking ceremony for a new building to expand its micro mold
Unicharm Enters Pet Care Business in Brazil
May 15, 2026 - Unicharm Corporation (President & CEO: Mr. Takahisa Takahara) hereby announces that it has decided to make Nutrire Indústria de Alimentos Ltda. (Address: RODOVI
TOPPAN Begins Mass Production of Flexible Packaging Using Japan's First EB Offset Printing
TOPPAN Co., Ltd. (Headquarters: Bunkyo-ku, Tokyo; President and CEO: Haruhiko Noguchi; hereinafter “TOPPAN”), a group company of TOPPAN Holdings, has developed Japan’s first
Kurimoto and Hitachi High-Tech launch collaboration to optimize mixing process conditions using mixing data and physical AI
Tokyo, May 11, 2026 – Kurimoto, Ltd. ("Kurimoto") and Hitachi High-Tech Corporation ("Hitachi High-Tech") have launched a collaboration to optimize mixing*1 p