TOKYO OHKA KOGYO Establishes Joint Venture "Zero Newton Solutions" with AIMECHATEC

Japan, October 20, 2026 - TOKYO OHKA KOGYO CO., LTD. (the “Company”) hereby announces that it has decided to establish a joint venture with AIMECHATEC, Ltd. (head office: Ryugasaki, Ibaraki Prefecture; President and Representative Director: Isao Abe; hereinafter, “AIMECHATEC”), as described below.

Purpose of Establishing the Joint Venture
With a view to advancing three-dimensional integration technologies in the advanced semiconductor packaging market, the Company and AIMECHATEC have decided to establish a joint venture to develop, evaluate, and optimize integrated solutions combining materials, equipment, and processes by bringing together the Company's materials technologies and AIMECHATEC's equipment technologies.
The joint venture will develop integration technologies for three-dimensional integration and provide field engineering services. Through these activities, it aims to improve its ability to respond to customer requirements, accelerate the development of technologies for next-generation advanced semiconductor packaging, including panel-level packaging (PLP), and capture future business opportunities.

Overview of the Joint Venture

Schedule
(1) Date of resolution by the Board of Directors: October 9, 2026
(2) Date of execution of the joint venture agreement: October 23, 2026
(3) Date of establishment and commencement of business: October 31, 2026 (scheduled)